The Design of Production Planning System for Integrating IC Packaging and Final Testing Processes
碩士 === 國立交通大學 === 工業工程與管理系所 === 92 === Following the throughput increasing in IC foundries, the demand of IC packaging and final testing is also increasing. Each enterprise thus establishes new factories to satisfy the customers’ need. The enterprise of IC package & final testing thus faces a di...
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2004
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| Online Access: | http://ndltd.ncl.edu.tw/handle/68857968844645277744 |