Electromigration study in eutectic SnPb solder by edge displacement technique
碩士 === 國立交通大學 === 材料科學與工程系所 === 92 === In this study, we have successfully developed a technique that can precisely measure the important parameters of solder electromigration. By applying currents in the Blech specimen and by measuring the depletion volume at appropriate conditions, electromigratio...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | en_US |
| Published: |
2004
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| Online Access: | http://ndltd.ncl.edu.tw/handle/d5pm7p |