Analysis of Ground Bounce and Radiated Emission Problems Associated with the Multi-layered Printed Circuit Board Using Finite-Difference-Frequency-Domain Method
碩士 === 國立交通大學 === 電信工程系所 === 92 === With the fast increase of chip clock frequency, the high frequency noise on power distribution network caused by ground Bounce is a primary source of electromagnetic interference (EMI) and signal integrity. In the multilayer printed circuit board, it is prevalent...
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2004
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| Online Access: | http://ndltd.ncl.edu.tw/handle/97xtn3 |