Analysis of Ground Bounce and Radiated Emission Problems Associated with the Multi-layered Printed Circuit Board Using Finite-Difference-Frequency-Domain Method
碩士 === 國立交通大學 === 電信工程系所 === 92 === With the fast increase of chip clock frequency, the high frequency noise on power distribution network caused by ground Bounce is a primary source of electromagnetic interference (EMI) and signal integrity. In the multilayer printed circuit board, it is prevalent...
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ndltd-TW-092NCTU54370712019-05-15T19:38:01Z http://ndltd.ncl.edu.tw/handle/97xtn3 Analysis of Ground Bounce and Radiated Emission Problems Associated with the Multi-layered Printed Circuit Board Using Finite-Difference-Frequency-Domain Method 以頻域有限差分法分析多層印刷電路板的地彈雜訊及輻射問題 Lin Yu-Chieh 林于傑 碩士 國立交通大學 電信工程系所 92 With the fast increase of chip clock frequency, the high frequency noise on power distribution network caused by ground Bounce is a primary source of electromagnetic interference (EMI) and signal integrity. In the multilayer printed circuit board, it is prevalent to use dedicated power/ground plane for power delivery network. In this thesis, we develop a Finite-Difference Frequency-Domain (FDFD) method to analyze transfer impedance (Z21) and transmission coefficient (S21) between any two ports of the rectangular power/ground plane structure. We also study the effects of capacitance value and positioning and number of decoupling capacitors on the suppression of ground bounce. Finally, we also study the problems of radiation from board edge caused by the ground bounce. Lin-Kun Wu 吳霖�O 2004 學位論文 ; thesis 64 zh-TW |
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碩士 === 國立交通大學 === 電信工程系所 === 92 === With the fast increase of chip clock frequency, the high frequency noise on power distribution network caused by ground Bounce is a primary source of electromagnetic interference (EMI) and signal integrity. In the multilayer printed circuit board, it is prevalent to use dedicated power/ground plane for power delivery network.
In this thesis, we develop a Finite-Difference Frequency-Domain (FDFD) method to analyze transfer impedance (Z21) and transmission coefficient (S21) between any two ports of the rectangular power/ground plane structure. We also study the effects of capacitance value and positioning and number of decoupling capacitors on the suppression of ground bounce. Finally, we also study the problems of radiation from board edge caused by the ground bounce.
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Lin-Kun Wu |
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Lin-Kun Wu Lin Yu-Chieh 林于傑 |
author |
Lin Yu-Chieh 林于傑 |
spellingShingle |
Lin Yu-Chieh 林于傑 Analysis of Ground Bounce and Radiated Emission Problems Associated with the Multi-layered Printed Circuit Board Using Finite-Difference-Frequency-Domain Method |
author_sort |
Lin Yu-Chieh |
title |
Analysis of Ground Bounce and Radiated Emission Problems Associated with the Multi-layered Printed Circuit Board Using Finite-Difference-Frequency-Domain Method |
title_short |
Analysis of Ground Bounce and Radiated Emission Problems Associated with the Multi-layered Printed Circuit Board Using Finite-Difference-Frequency-Domain Method |
title_full |
Analysis of Ground Bounce and Radiated Emission Problems Associated with the Multi-layered Printed Circuit Board Using Finite-Difference-Frequency-Domain Method |
title_fullStr |
Analysis of Ground Bounce and Radiated Emission Problems Associated with the Multi-layered Printed Circuit Board Using Finite-Difference-Frequency-Domain Method |
title_full_unstemmed |
Analysis of Ground Bounce and Radiated Emission Problems Associated with the Multi-layered Printed Circuit Board Using Finite-Difference-Frequency-Domain Method |
title_sort |
analysis of ground bounce and radiated emission problems associated with the multi-layered printed circuit board using finite-difference-frequency-domain method |
publishDate |
2004 |
url |
http://ndltd.ncl.edu.tw/handle/97xtn3 |
work_keys_str_mv |
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