Analysis of Ground Bounce and Radiated Emission Problems Associated with the Multi-layered Printed Circuit Board Using Finite-Difference-Frequency-Domain Method

• Main Authors: Lin Yu-Chieh, 林于傑
• Other Authors: Lin-Kun Wu
• Format: Others
• Language: zh-TW
• Published: 2004
• Online Access: http://ndltd.ncl.edu.tw/handle/97xtn3

碩士 === 國立交通大學 === 電信工程系所 === 92 === With the fast increase of chip clock frequency, the high frequency noise on power distribution network caused by ground Bounce is a primary source of electromagnetic interference (EMI) and signal integrity. In the multilayer printed circuit board, it is prevalent to use dedicated power／ground plane for power delivery network. In this thesis, we develop a Finite-Difference Frequency-Domain (FDFD) method to analyze transfer impedance (Z21) and transmission coefficient (S21) between any two ports of the rectangular power／ground plane structure. We also study the effects of capacitance value and positioning and number of decoupling capacitors on the suppression of ground bounce. Finally, we also study the problems of radiation from board edge caused by the ground bounce.