Run-to-Run Cu-CMP Process Control Using Fuzzy Neural Network
碩士 === 國立交通大學 === 機械工程系所 === 92 === Chemical Mechanical Polishing (CMP) is a very complex process and the process involved many areas of studying [1]. They are Chemistry, Mechanics, Physics, etc. The research of [1] explores the removal mechanism of the CMP process and it also derives the model of...
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| Format: | Others |
| Language: | zh-TW |
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2004
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| Online Access: | http://ndltd.ncl.edu.tw/handle/p7x5ah |