Study of Cu dissolution induced by Electromigration
碩士 === 國立中央大學 === 化學工程與材料工程研究所 === 92 === To study the kinetics of Cu dissolution induced by electromigration,we produce a flip chip structure by connecting two Cu foil with a solder bump. Three different Sn-Cu solders are studied which are Sn, Sn0.7Cu,and Sn3.0Cu. The solder bumps are stressed by c...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2004
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| Online Access: | http://ndltd.ncl.edu.tw/handle/93091112135733940130 |