The Study of Microstructure Analysis of Sn-Zn And Sn-Zn-Al Solder Ball in BGA Package.
碩士 === 國立中山大學 === 材料科學研究所 === 92 === none
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2004
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| Online Access: | http://ndltd.ncl.edu.tw/handle/59527353602908248493 |