Failure mechanism of wire bonding in IC package process
碩士 === 國立中山大學 === 電機工程學系研究所 === 92 === Aluminum bond pads on semiconductor chips play an important role in IC device reliability and yield. In the paper, the vertical tension loading transferred from the capillary is clarified as the direct driving force for bond pad metal peeling. The crack on the...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2004
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| Online Access: | http://ndltd.ncl.edu.tw/handle/30674209529454619280 |