Electroless deposition of Ni-W-p film as diffusion barrier for Cu interconnect
碩士 === 國立清華大學 === 化學工程學系 === 92 === Our study is to develop a new diffusion barrier with low resistivity and high thermal stability via electroless deposition, and get a good control of Ni-W-P film composition by adjusting the bath condition and other parameters including bath temperature, [Na2WO4]...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | en_US |
| Published: |
2004
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| Online Access: | http://ndltd.ncl.edu.tw/handle/rt462u |