A Kinetic Study of Sn/Cu Bimetallic Thin Film Reaction
碩士 === 國立清華大學 === 材料科學工程學系 === 92 === Flip-Chip technology is becoming a mainstream process due to the advantages of packaging density, functionality and cost. The reliability of solder ball and Under Ball Metallurgy(UBM) remains the critical issue for flip-chip structures. A systematic study of int...
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| Format: | Others |
| Language: | zh-TW |
| Online Access: | http://ndltd.ncl.edu.tw/handle/fg8qhe |