A Study of The Fixed Abrasives Pad is worn and conditioned
碩士 === 國立清華大學 === 動力機械工程學系 === 92 === Chemical mechanical polishing (CMP) is the most effective method to achieve global planarization in semiconductor industry. The polishing pad is one of the primary consumables in CMP. Extending the life of polishing pad can reduce cost of consumables and improve...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2004
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| Online Access: | http://ndltd.ncl.edu.tw/handle/48067216195943006091 |