Investigation and Analysis of the Thermosyphon Vapor Chamber

碩士 === 國立臺灣大學 === 機械工程學研究所 === 92 === The research applies the concept of high latten heat of boiling liquid to design a new type of heat removal device: “Thermosyphon Vapor Chamber, TSVC” and combine it with fans to make it a heat removal module. The system heat removal ability was studied under th...

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Bibliographic Details
Main Authors: Hung-Ming Chen, 陳宏鳴
Other Authors: Sih-Li Chen
Format: Others
Language:zh-TW
Published: 2004
Online Access:http://ndltd.ncl.edu.tw/handle/06601884563437105610