Application on Silicon Wafer Grinding Process Performance Enhancement
碩士 === 國立臺灣大學 === 機械工程學研究所 === 92 === Grinding has gained important status in the IC packaging , wafer manufacture and wafer reclaim industry. Grinding process could reach low TTV (Total Thickness Variation) , excellent surface roughness , rapid material removal rate , reduced cycle time and higher...
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2004
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| Online Access: | http://ndltd.ncl.edu.tw/handle/53314783598268155061 |