A novel method for in-situ monitoring the thickness of a wafer during wet etching

博士 === 國立臺灣大學 === 機械工程學研究所 === 92 === This work presents a novel method based on the plate wave sensor for in-situ monitoring of the thickness of a wafer during wet etching. Some acoustic wave devices require that the thickness of a wafer be known precisely. Precisely controlling the thickness of a...

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Bibliographic Details
Main Authors: Chi-Yuan Lee, 李其源
Other Authors: 張培仁
Format: Others
Language:zh-TW
Published: 2004
Online Access:http://ndltd.ncl.edu.tw/handle/25108022580353730650