A novel method for in-situ monitoring the thickness of a wafer during wet etching
博士 === 國立臺灣大學 === 機械工程學研究所 === 92 === This work presents a novel method based on the plate wave sensor for in-situ monitoring of the thickness of a wafer during wet etching. Some acoustic wave devices require that the thickness of a wafer be known precisely. Precisely controlling the thickness of a...
Main Authors: | Chi-Yuan Lee, 李其源 |
---|---|
Other Authors: | 張培仁 |
Format: | Others |
Language: | zh-TW |
Published: |
2004
|
Online Access: | http://ndltd.ncl.edu.tw/handle/25108022580353730650 |
Similar Items
-
Feasibility Study on Wet Etching for Wafer Sawing Technology
by: Hsin-Jung Tsai, et al.
Published: (2015) -
Wetting behavior on copper wafers after etch cleaning processes
by: Sheng-Hung Tu, et al.
Published: (2014) -
The modification of electric properties of buckypaper by wet etching process
by: Chi-Hua Li, et al.
Published: (2014) -
Thickness control in electrogenerated mesoporous silica films by wet etching and electrochemical monitoring of the process
by: Taisiia Sikolenko, et al.
Published: (2019-03-01) -
Research on Chemical Wet Etching and Polishing and Surface Roughness of AT-cut Quartz Wafer
by: Yu,Wan-Ting, et al.
Published: (2016)