A novel method for in-situ monitoring the thickness of a wafer during wet etching
博士 === 國立臺灣大學 === 機械工程學研究所 === 92 === This work presents a novel method based on the plate wave sensor for in-situ monitoring of the thickness of a wafer during wet etching. Some acoustic wave devices require that the thickness of a wafer be known precisely. Precisely controlling the thickness of a...
| Main Authors: | , |
|---|---|
| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2004
|
| Online Access: | http://ndltd.ncl.edu.tw/handle/25108022580353730650 |