Measurements of Diffusion Coefficients and Adhesive Energies of Copper with TaNx Thin Films as the Diffusion Barriers
碩士 === 國立臺灣科技大學 === 材料科技研究所 === 92 === This study is to evaluate the application and feasibility of TaNx thin films as diffusion barriers for Cu/Si multilayer system. We deposited TaNx thin films on silicon substrates by reactive radio frequency magnetron sputtering from a Ta(99.95％) target with an...
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2004
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| Online Access: | http://ndltd.ncl.edu.tw/handle/54744499764941643323 |