Surfactant Removal of Copper Ion and Abrasive Colloidal Contamination in the Post-CMP
碩士 === 國立臺北科技大學 === 材料及資源工程系碩士班 === 92 === The size of Ultra- Large- Scale- Integration (ULSI) components is getting smaller. Traditionally, aluminum interconnects are used as connecting materials. However, as a result of high electrical resistivity of aluminum, the amount of the interconnects layer...
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2004
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| Online Access: | http://ndltd.ncl.edu.tw/handle/00981667077625437663 |