Studies and Application of Self-Assembled Monolayers on Microvia Filling of PCB by Copper Plating
碩士 === 國立雲林科技大學 === 工業化學與災害防治研究所 === 92 === Recently, electronics products become lighter, thinner, shorter, multi-functional and complicated. The distance of contact between the integrated circuit devices is shorter and shorted and the speed of signal transmission is required faster and faster, rel...
| Main Authors: | , |
|---|---|
| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2004
|
| Online Access: | http://ndltd.ncl.edu.tw/handle/61102499282201630082 |