Full-field optical 3D measurement for the quality inspection of SMT electronics packaging
博士 === 元智大學 === 工業工程與管理學系 === 92 === Abstract Full-field optical 3D measurement for the quality inspection of SMT electronics packaging Three-dimensional (3D) measurement is important for the quality inspection of SMT electronics packaging. In this study, a cost-effe...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | en_US |
| Published: |
2004
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| Online Access: | http://ndltd.ncl.edu.tw/handle/24355226253405896495 |