The optimiztion of the Gold Stud Bump process used in the Flip Chip technology
碩士 === 元智大學 === 化學工程學系 === 92 === The optimization of operating parameters of wire bonder to produce gold stud bump on silicon wafer was evaluate using design of experimental methods. The effects of the operating parameters on the ball shear, ball size, ball height were analyzed by Taquchi and artif...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2004
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| Online Access: | http://ndltd.ncl.edu.tw/handle/06695328465957036721 |