The optimiztion of the Gold Stud Bump process used in the Flip Chip technology

• Main Authors: Burce Chen, 陳興進
• Other Authors: Leo Chau-Kuang Liau
• Format: Others
• Language: zh-TW
• Published: 2004
• Online Access: http://ndltd.ncl.edu.tw/handle/06695328465957036721

碩士 === 元智大學 === 化學工程學系 === 92 === The optimization of operating parameters of wire bonder to produce gold stud bump on silicon wafer was evaluate using design of experimental methods. The effects of the operating parameters on the ball shear, ball size, ball height were analyzed by Taquchi and artificial Neural networks methods. Results show that the first bond-bond force, electronic flame off (EFO)-current and time, and Ultrasonic power and time are important factors to in flue the stud bump properties. If the EFO current and time increase, the ball shear increase; Meanwhile the ball shape can be well maintained. However, if the first bond-bond force rises, the change of ball size and ball height is apparent. In addition, higher temperature of bond pad can produce better ball shear. The proposed algorithm can evaluate the optimal operating parameters on the stud bumping process.