The influence of grit concentration and feedrate on the surface integrity of the back-thinned silicon wafer.
碩士 === 國防大學中正理工學院 === 兵器系統工程研究所 === 93 === The silicon-based micro-chips and related semiconductor products are widely used in modern weapon systems for their ever-improving performance and they are still fast marching towards even lighter, thinner, shorter, smaller, higher power output and more den...
| Main Authors: | , |
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2005
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| Online Access: | http://ndltd.ncl.edu.tw/handle/72067684105880708747 |