Study of Applying Piezoelectric Actuators on Extreme Low Stress Polishing Processing
碩士 === 國立中正大學 === 機械系 === 93 === The polishing process for the wafer with copper leads wire and low-k dielectric material is quite different from the traditional CMP (Chemical Mechanical Planarization) approach due to the possible distortion and de-lamination. In this research, the vibration techniq...
| Main Authors: | , |
|---|---|
| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2004
|
| Online Access: | http://ndltd.ncl.edu.tw/handle/72581212207759255162 |