| Summary: | 碩士 === 國立中正大學 === 機械系 === 93 === The polishing process for the wafer with copper leads wire and low-k dielectric material is quite different from the traditional CMP (Chemical Mechanical Planarization) approach due to the possible distortion and de-lamination. In this research, the vibration technique using piezoelectric actuator is utilized to develop the new type CMP machine for the application on low stress polishing process. Since there is no literature discussing the issues for using vibrating approach in CMP, we propose two novel designs standing and traveling wave type actuators to design the polishing head. The dynamic responses of the vibrating actuators are analyzed, and the experiments on actuators are conducted to provide more understanding on the polishing process. The experimental results will provide the guidelines for the new CMP machine design, and performance evaluation. Besides the experimental results, this research provides some theoretical models for using vibrating mechanism in low stress CMP process. We wish that it can help in choosing the parameters for CMP process and the testing time requirement can be reduced.
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