Study of Applying Piezoelectric Actuators on Extreme Low Stress Polishing Processing
碩士 === 國立中正大學 === 機械系 === 93 === The polishing process for the wafer with copper leads wire and low-k dielectric material is quite different from the traditional CMP (Chemical Mechanical Planarization) approach due to the possible distortion and de-lamination. In this research, the vibration techniq...
Main Authors: | Tai-Hung Shih, 施泰宏 |
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Other Authors: | Meng-Shiun Tsai |
Format: | Others |
Language: | zh-TW |
Published: |
2004
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Online Access: | http://ndltd.ncl.edu.tw/handle/72581212207759255162 |
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