Study on the Gold Stud Bump Bonding Process on Copper Pads for Chips with Copper Interconnects
碩士 === 國立中正大學 === 機械系 === 93 === Flip chip assembly is an attractive solution for high performance and miniaturized microelectronics packaging. A well-established process for flip chip assembly is based on lead-tin solder, which requires flux to remove oxide during assembly. While it serves high yie...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | en_US |
| Published: |
2005
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| Online Access: | http://ndltd.ncl.edu.tw/handle/61176931911621946524 |