Application of Model Predictive Control Technology to Chemical Mechanical Polishing Process
碩士 === 長庚大學 === 化工與材料工程研究所 === 93 === As the integrated circuit structure tends to be tiny and multilayered, the planarization problem of the wafer surface becomes an important issue, especially in deep submicron manufacturing processes. It is known that chemical mechanical planarization (CMP) is a...
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| Format: | Others |
| Language: | zh-TW |
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2005
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| Online Access: | http://ndltd.ncl.edu.tw/handle/59317516477293235547 |