Thermal Analysis of LED Packages and Modules by FVM
碩士 === 長庚大學 === 機械工程研究所 === 93 === The purpose of this study is to investigate the thermal behaviors of light emitting diode (LED).One of the primary mathematical tools used in the thermal management design is Thermal Resistance (Rja).The thermal Resistance is defined as the ratio of temperature dif...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2005
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| Online Access: | http://ndltd.ncl.edu.tw/handle/43133410831706162391 |