A Parametric Study of Thermal Module for Desktop Computer
碩士 === 中原大學 === 機械工程研究所 === 93 === Abstract As a result of the recent development in the electronic products towards miniaturization, high power density, and high frequency, the corresponding energy dissipation per unit area of them is increasing, leading to the associated problems related to the...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2005
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| Online Access: | http://ndltd.ncl.edu.tw/handle/sv9t69 |