Applying Response Surface Methodology to Solve the Optimum Parameters of Wire Bonding Process on the IC Packages

碩士 === 中原大學 === 機械工程研究所 === 93 === In the semi-conductor assembly technology industries, following process of the technology, the development trends of different electric equipment products move towards the light, thin, short, small, and multi-functional merger direction. At present semiconductor en...

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Bibliographic Details
Main Authors: Yung-Ching Chen, 陳永慶
Other Authors: Wen-Ren Jong
Format: Others
Language:zh-TW
Published: 2005
Online Access:http://ndltd.ncl.edu.tw/handle/35k4v3