Applying Response Surface Methodology to Solve the Optimum Parameters of Wire Bonding Process on the IC Packages

• Main Authors: Yung-Ching Chen, 陳永慶
• Other Authors: Wen-Ren Jong
• Format: Others
• Language: zh-TW
• Published: 2005
• Online Access: http://ndltd.ncl.edu.tw/handle/35k4v3

碩士 === 中原大學 === 機械工程研究所 === 93 === In the semi-conductor assembly technology industries, following process of the technology, the development trends of different electric equipment products move towards the light, thin, short, small, and multi-functional merger direction. At present semiconductor encapsulation manufacturing fields all move towards the high density, high pin-foot, and high I/O. Following this semi-conductor assembly technology trends, the wire bonding manufacturing process of the semi-conductor assembly goes also towards the high precision wire bonding technology with fine pitch bonding. This paper is applied the response surface method to solve the optimum parameters of the wire bonding process on the IC packages, and setup two steps of design experience method. The first step is considered the all the factors which will impact on the wire bonding process, then applies the factional factor method to find out the effective factors of the wire bonding process with the fine pitch. The second step uses the response surface method with the central composite design to solve the optimize parameters range. The result showed that the CV, USG current, and force are the key factor in the first experiment, and the three key factors are again applied with both the response surface method and the central composite design to solve the optimum parameters ranges. It is not only the shortest time, but also gain to strengthen company's international competition, and then enable the incorporated business to manage continuously forever.