Applying Response Surface Methodology to Solve the Optimum Parameters of Wire Bonding Process on the IC Packages
碩士 === 中原大學 === 機械工程研究所 === 93 === In the semi-conductor assembly technology industries, following process of the technology, the development trends of different electric equipment products move towards the light, thin, short, small, and multi-functional merger direction. At present semiconductor en...
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2005
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| Online Access: | http://ndltd.ncl.edu.tw/handle/35k4v3 |