The Effect of Tin Plating Thickness on Tin Whisker Formation
碩士 === 義守大學 === 材料科學與工程學系 === 93 === Semiconductor and electronics industries such as Integrated Circuit (IC) manufacturing companies have been recognized the environment concerns that arise from the use of lead (Pb) and its compound in some of their manufacturing operations, such as solder plating....
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2005
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| Online Access: | http://ndltd.ncl.edu.tw/handle/85645192042662465070 |