The Investigation of Interfacial Reaction between Gold Stud Bump and Solder in Flip-Chip Chip Scale Package
碩士 === 義守大學 === 材料科學與工程學系 === 93 === This research has been conducted to investigate the variation of micro-structure due to the interfacial reaction between Gold Stud Bump and Sn63/Pb37 pre-solder substrate. After high temperature 150C storage test from 0 hour to 2000 hours, AuSn, AuSn2, and AuSn4...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2005
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| Online Access: | http://ndltd.ncl.edu.tw/handle/35564230435829599819 |