Study of High Filler Content Epoxy Molding Compound in Heat Slug Ball Grid Array Packaging
碩士 === 義守大學 === 電子工程學系 === 93 === IC packaging comprises many materials and the coefficient of thermal expansion of each material is different. Due to the variation of temperature in IC packaging process or reliability test, the thermal stress results in warpage, deformation, die crack and delaminat...
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2005
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| Online Access: | http://ndltd.ncl.edu.tw/handle/88961795231973568862 |