A study of mechanical properties and interfacial adhesion of low-k dielectric thin film for microelectronic applications
碩士 === 義守大學 === 機械與自動化工程學系碩士班 === 93 === Cabon doped silicon oxide low-k thin films deposited by the plasma enhanced chemical vapor deposition technique from trimethylsilane and oxygen have been prepared. Effects of chemical mechanical polishing on the mechanical properties and interfacial fracture...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2005
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| Online Access: | http://ndltd.ncl.edu.tw/handle/88743372263796683056 |