A study of mechanical properties and interfacial adhesion of low-k dielectric thin film for microelectronic applications
碩士 === 義守大學 === 機械與自動化工程學系碩士班 === 93 === Cabon doped silicon oxide low-k thin films deposited by the plasma enhanced chemical vapor deposition technique from trimethylsilane and oxygen have been prepared. Effects of chemical mechanical polishing on the mechanical properties and interfacial fracture...
Main Authors: | , |
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Other Authors: | |
Format: | Others |
Language: | zh-TW |
Published: |
2005
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Online Access: | http://ndltd.ncl.edu.tw/handle/88743372263796683056 |