Analysis of Wafer Abrasive-Free Polishing Process

碩士 === 國立中興大學 === 機械工程學系 === 93 === Abstract Abrasive-Free Polishing (AFP) , which mainly focuses on avoiding shear marks caused by mechanical abrasion from abrasives during the dynamic polishing process, is a planarization technology which is quite different from ordinary Chemical Mechanical Polish...

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Bibliographic Details
Main Authors: Kun Lung Lin, 林坤龍
Other Authors: Jerry M. Chen
Format: Others
Language:zh-TW
Published: 2005
Online Access:http://ndltd.ncl.edu.tw/handle/96067357675316129706