Characteristic Analysis on Fusion Current and Solidification Scale of Sn-3.5Ag-xCu Lead-free Solders
碩士 === 國立成功大學 === 材料科學及工程學系碩博士班 === 93 === Sn-Ag-Cu solder balls are extensively applied in the electronic packaging technique. Because the solder balls are used to transmit current, high current density may induce the failure of solder joints. In addition, the surfaces of Sn-Ag-Cu solder balls di...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2005
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| Online Access: | http://ndltd.ncl.edu.tw/handle/48965807109264858759 |