The Simulation of Shape Evolution of Solder Joints During Reflow Process and Its Experimental Validation
碩士 === 國立成功大學 === 材料科學及工程學系碩博士班 === 93 === As electronic packaging technologies continue to move toward smaller scale and higher density, the use of area array type packages have gradually replaced the peripheral type packages. Solder joints are used to provide both mechanical and electrical conne...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2005
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| Online Access: | http://ndltd.ncl.edu.tw/handle/24131855756296467072 |