Thermomigration and Electromigration in Flip Chip Sn-Ag-Cu Solder Bumps
碩士 === 國立成功大學 === 材料科學及工程學系碩博士班 === 93 === The present work investigated the behaviors of electromigration and thermomigration in the Sn-3.0Ag-0.5Cu Pb-free flip chip solder bumps at 120°C by applying a three-bump set therein the electrical current flows in different directions. The third bump mai...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2005
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| Online Access: | http://ndltd.ncl.edu.tw/handle/54689599890953659188 |