The numerical simulation and optimization of PBGA package
碩士 === 國立成功大學 === 機械工程學系碩博士班 === 93 === This research is using 3-dimensional model simulation to analyze the thermal-mechanical and heat transfer behavior of EPBGA by applying finite element analysis ANSYS 8.1. EPBGA model consists of seven parts, they are heat spreader, molding compound, chip, subs...
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ndltd-TW-093NCKU54901082017-06-05T04:45:22Z http://ndltd.ncl.edu.tw/handle/10227285322289614271 The numerical simulation and optimization of PBGA package PBGA構裝體的數值模擬與最佳化之研究 Chia-Sheng Lo 羅家昇 碩士 國立成功大學 機械工程學系碩博士班 93 This research is using 3-dimensional model simulation to analyze the thermal-mechanical and heat transfer behavior of EPBGA by applying finite element analysis ANSYS 8.1. EPBGA model consists of seven parts, they are heat spreader, molding compound, chip, substrate, thermal vias, solder ball and PCB board. The model is constructed by different materials and each material has its own function to demonstrate its characteristic. For analysis on thermal-mechanical behavior, the viscoplastic behavior of solder ball is modeled using Anand model, the viscoelastic behavior of molding compound is simulated by Maxwell model, the other parts are using linear elastic model to simulate. As a result, analysis of transformation behavior of EPBGA can be carried out under a 125℃~-40℃heat cycling environment. For heat spreading analysis, the beginning temperature of EPBGA and surrounding area is 25℃, the heat dissipation per volume unit of chip is 0.03 W/mm3. When it reaches stable condition, analysis of heat transfer behavior and stress and strain distributions will be carried out. Moreover, this research is using Grey relational analysis and Taguchi’s orthogonal arrays to achieve the design of optimization of multiple responses. The required responses are the solder ball response and the stress and strain distributions of EPBGA. Accompanying suitable control factors, the experimental data of Taguchi’s orthogonal arrays can be analyzed, on the other hand, by applying Grey relational analysis to perform simple calculations and constructing response table and response graph, optimal design can be achieved. Gien-Huang Wu 吳俊煌 2005 學位論文 ; thesis 117 zh-TW |
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碩士 === 國立成功大學 === 機械工程學系碩博士班 === 93 === This research is using 3-dimensional model simulation to analyze the thermal-mechanical and heat transfer behavior of EPBGA by applying finite element analysis ANSYS 8.1. EPBGA model consists of seven parts, they are heat spreader, molding compound, chip, substrate, thermal vias, solder ball and PCB board. The model is constructed by different materials and each material has its own function to demonstrate its characteristic. For analysis on thermal-mechanical behavior, the viscoplastic behavior of solder ball is modeled using Anand model, the viscoelastic behavior of molding compound is simulated by Maxwell model, the other parts are using linear elastic model to simulate. As a result, analysis of transformation behavior of EPBGA can be carried out under a 125℃~-40℃heat cycling environment. For heat spreading analysis, the beginning temperature of EPBGA and surrounding area is 25℃, the heat dissipation per volume unit of chip is 0.03 W/mm3. When it reaches stable condition, analysis of heat transfer behavior and stress and strain distributions will be carried out.
Moreover, this research is using Grey relational analysis and Taguchi’s orthogonal arrays to achieve the design of optimization of multiple responses. The required responses are the solder ball response and the stress and strain distributions of EPBGA. Accompanying suitable control factors, the experimental data of Taguchi’s orthogonal arrays can be analyzed, on the other hand, by applying Grey relational analysis to perform simple calculations and constructing response table and response graph, optimal design can be achieved.
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Gien-Huang Wu |
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Gien-Huang Wu Chia-Sheng Lo 羅家昇 |
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Chia-Sheng Lo 羅家昇 |
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Chia-Sheng Lo 羅家昇 The numerical simulation and optimization of PBGA package |
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Chia-Sheng Lo |
title |
The numerical simulation and optimization of PBGA package |
title_short |
The numerical simulation and optimization of PBGA package |
title_full |
The numerical simulation and optimization of PBGA package |
title_fullStr |
The numerical simulation and optimization of PBGA package |
title_full_unstemmed |
The numerical simulation and optimization of PBGA package |
title_sort |
numerical simulation and optimization of pbga package |
publishDate |
2005 |
url |
http://ndltd.ncl.edu.tw/handle/10227285322289614271 |
work_keys_str_mv |
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