The Effect of Different Cu Addition on The Microstructure and Shear Strength of Lead-Free Sn-Ag-Sb Solder Joints
碩士 === 國立成功大學 === 機械工程學系碩博士班 === 93 === The effects of adding 0~1.5wt% Cu into Sn-3Ag-2Sb lead-Free solder on the melting point and microstructure as well as the interfacial IMC(Intermetallic Compound) layer are studied in this reseach. The Single Lap specimens and high temperature storage evaluate...
Main Authors: | , |
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Other Authors: | |
Format: | Others |
Language: | zh-TW |
Published: |
2005
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Online Access: | http://ndltd.ncl.edu.tw/handle/64983371988402582158 |