The Effect of Different Cu Addition on The Microstructure and Shear Strength of Lead-Free Sn-Ag-Sb Solder Joints
碩士 === 國立成功大學 === 機械工程學系碩博士班 === 93 === The effects of adding 0~1.5wt% Cu into Sn-3Ag-2Sb lead-Free solder on the melting point and microstructure as well as the interfacial IMC（Intermetallic Compound） layer are studied in this reseach. The Single Lap specimens and high temperature storage evaluate...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2005
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| Online Access: | http://ndltd.ncl.edu.tw/handle/64983371988402582158 |