Subpixel BGA Images Alignment Based on Moment Methods
碩士 === 國立成功大學 === 電腦與通信工程研究所 === 93 === BGA (Ball Grid Array), a technology of packaging, is widely used in the integrated circuits. The model name and function of each IC chip through laser marking are to be identified by recognizing the etched mark on package surface. For instance, chip group, CP...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | en_US |
| Published: |
2005
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| Online Access: | http://ndltd.ncl.edu.tw/handle/10127890008406942535 |