Preparation of Electroless Co-P Thin-film as the Diffusion Barrier of Pb-Sn Solder
碩士 === 國立交通大學 === 材料科學與工程系所 === 93 === Electroless plating technique was utilized to prepare the cobalt-phosphorous (Co-P) thin film to serve as the diffusion barrier layer of lead-tin (Pb-Sn) solder. Co-P/solder interfacial reactions were characterized in order to evaluate the feasibility of electr...
| Main Authors: | , |
|---|---|
| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2005
|
| Online Access: | http://ndltd.ncl.edu.tw/handle/82159016632260457186 |