Cu-CMP with Organic Additive and W-CMP with Different Dilution Ratio
碩士 === 國立交通大學 === 電子工程系所 === 93 === Although Cu-CMP is the key point in dual damascene structure in semiconductor manufacture, that the composition of slurry is the significant cost, it will affect the polishing rate, uniformity, selectivity and surface defeats…etc. In order to integrate with porous...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | en_US |
| Published: |
2005
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| Online Access: | http://ndltd.ncl.edu.tw/handle/02177844601360516257 |