Interfacial reaction between NiCu alloyand Sn3Ag solder
碩士 === 國立中央大學 === 化學工程與材料工程研究所 === 93 === ABSTRACT Diffusion barrier plays an important role in soldering, it can prevent fast reaction between tin and copper. Beside nickel and platinum, nickel-copper alloy is a possible diffusion barrier in the future. In the past, our labortoary investigated li...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2005
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| Online Access: | http://ndltd.ncl.edu.tw/handle/31941990208634325126 |