Creep Properties of Sn-3.5Ag-0.5Cu Lead-Free Solder under Step-Loading
碩士 === 國立中央大學 === 機械工程研究所 === 93 === The purpose of this study is to investigate the creep behavior and develop a suitable creep damage model for a lead-free Sn-3.5Ag-0.5Cu solder alloy subjected to variable-step creep loading. Creep tests were conducted under two-step loading with various combinat...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | en_US |
| Published: |
2005
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| Online Access: | http://ndltd.ncl.edu.tw/handle/80783674182901815198 |