Electrochemical Migration of Sn-9Zn-(0~4)Ag Reflowed on Cu/Ni/Au Substrate in Pure Water
碩士 === 國立中央大學 === 機械工程研究所 === 93 === Abstract Electrochemical migration behaviors of the Sn-9Zn-(0~4)Ag solders reflowed on Cu/Ni/Au substrate have been studied. The electrochemical migration resistance of the Sn-9Zn-(0~4)Ag solders at a bias of 3V~5V in pure water decreased with in creasing Ag cont...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2005
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| Online Access: | http://ndltd.ncl.edu.tw/handle/46888564685725419621 |