Implementation of the Ka Band Receiver Front-End Circuits with Flip-Chip Package Technology and Distributed Amplifier Design
碩士 === 國立中央大學 === 通訊工程研究所 === 93 === Title：Implementation of the Ka Band Receiver Front-End Circuits with Flip-Chip Package Technology and Distributed Amplifier Design School：National Central University Department of Communication Engineering Student：Dian-Chi Li Advisor：Dr. Hwann...
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2005
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| Online Access: | http://ndltd.ncl.edu.tw/handle/36573920761580617507 |