A Study of Effects of Solder Joint Layout, Geometry and Manufacturing Parameters on the Reliability of Micro-Electronic Devices
博士 === 國立清華大學 === 動力機械工程學系 === 93 === During the design and manufacturing processes of electronic packaging, solder joints are fabricated using a variety of methods to provide both mechanical and electrical connections for different applications such as flip-chip, wafer-level packaging, fine-pitch b...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2004
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| Online Access: | http://ndltd.ncl.edu.tw/handle/62j5jw |